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| DATA SHEET MOS INTEGRATED CIRCUIT PD16901 FLASH MEMORY VOLTAGE STEPUP DC/DC CONVERTER IC The PD16901 is a DC/DC converter IC which produces a 12 V output from a 5 V input source. The integration of a control circuit and power MOSFET in the output stage on a single-chip allows a power supply for flash memory write and erasure to be configured with a reduced number of external components. FEATURES * With an on-chip output stage power MOSFET, fewer external components are needed. * The ALLMOS structure achieves low power consumption. * Internally set output voltage eliminates the need for adjustment. * Output can be turned ON/OFF via an external signal. * A timer latch type overcurrent protection circuit on chip ORDERING INFORMATION Part Number Package 14-pin plastic SOP (300 mil) PD16901GS BLOCK DIAGRAM ON/OFF VIN CDLY C1H C1L C2 Reference voltage circuit Startup circuit Timer latch short-circuit protection circuit Charge pump circuit VSW F/F SW Overcurrent detection circuit Oscillation circuit C.S. FB RT GND The information in this document is subject to change without notice. Document No. S10643EJ2V0DS00 (2nd edition) Date Published May 1997 N Printed in Japan (c) 1997 PD16901 ABSOLUTE MAXIMUM RATINGS (TA = 25 C unless specified otherwise) Item Supply voltage Output voltage Total power dissipation Operating ambient temperature Storage temperature range Symbol VIN VSW PT TA Tstg Note Condition Rating 7.0 20 0.9 -20 to 85 -55 to +150 Unit V V W C C Note When 90 mm x 90 mm x 1.6 mm thick glass epoxy board is mounted RECOMMENDED OPERATING RANGE Item Supply voltage Charge pump capacitor Operating ambient temperature Symbol VDD C1, C2 TA MIN. 4.5 0.033 0 TYP. 5.0 0.1 MAX. 5.5 0.47 70 Unit V F C ELECTRICAL SPECIFICATIONS Item (Oscillation block) Oscillation frequency On duty (TA = 25 C, VIN = 5 V unless specified otherwise) Symbol Condition MIN. TYP. MAX. Unit fOSC DUTY RT = 68 k 153 167 67 181 kHz % (Low voltage misoperation preventive circuit) Operation start voltage Operation stop voltage Hysteresis width (Overcurrent detection block) Overcurrent detection voltage (On/off control block) ON/OFF pin input voltage VIH VIL ON/OFF pin input current (Charge pump circuit) Output voltage VCHG 4.5 V VIN 5.5 V 0 C TA 70 C 8.0 11 V IIL 4.5 V VIN 5.5 V 4.5 V VIN 5.5 V ON/OFF pin voltage = 0 -20 -5 VIN*0.7 VIN*0.3 -1 V V VDET 270 300 330 mV VIN(start-up) VIN(stop) VHYS 3.3 2.7 0.3 3.7 3.2 0.5 4.3 3.8 0.7 V V V A (Short-circuit protection circuit) Timer latch pin output current Timer latch detection voltage (Output block) Output stage on resistance Output stage leakage current RDS(ON) IDSOFF IPK = 0.5 A VDS = 20 V 0.3 0.5 1.0 ISCP VDETT RT = 68 k 2.0 0.85 3.3 1.0 4.5 1.15 A V A 2 PD16901 PIN CONFIGURATION (Top View) C2 14 VSW 13 NC 12 NC 11 NC 10 CS 9 FB 8 1 C1H 2 C1L 3 VCC 4 5 6 CDLY 7 GND ON/OFF RT CONTROL 3 PD16901 PACKAGE DRAWINGS 14 PIN PLASTIC SOP (300 mil) 14 8 detail of lead end 1 A 7 H I G P J F E K C D NOTE B M M L N ITEM A B C D E F G H I J K L M N P MILLIMETERS 10.46 MAX. 1.42 MAX. 1.27 (T.P.) 0.40 +0.10 -0.05 0.10.1 1.8 MAX. 1.55 7.70.3 5.6 1.1 0.20 +0.10 -0.05 0.60.2 0.12 0.10 3 +7 -3 INCHES 0.412 MAX. 0.056 MAX. 0.050 (T.P.) 0.016 +0.004 -0.003 0.0040.004 0.071 MAX. 0.061 0.3030.012 0.220 0.043 0.008 +0.004 -0.002 0.024 +0.008 -0.009 0.005 0.004 3 +7 -3 P14GM-50-300B-4 Each lead centerline is located within 0.12 mm (0.005 inch) of its true position (T.P.) at maximum material condition. 4 PD16901 STANDARD CHARACTERISTIC CURVES PT - TA characteristic 1.4 Oscillation frequency fOSC (kHz) Total Power dissipation PT (W) fOSC -VIN characteristic 180 1.2 1.0 0.8 0.9 W When mounted on 90 mm x 90 mm x 1.6 mm glass epoxy board TA = 25 C 175 170 139 C/W 0.6 0.4 0.2 0 -20 165 160 85 C 155 0 20 40 60 80 100 Ambient temperature TA (C) 3.5 4.0 5.5 4.5 5.0 Input voltage VIN (V) 6.0 6.5 ICC (ON) - VIN characteristic 3.5 Operating circuit current ICC (ON) (mA) fOSC - TA characteristic 180 VIN = 5 V Oscillation frequency fOSC (kHz) TA = 85 C 3.0 2.5 TA = 0 C 2.0 1.5 1.0 0.5 0 3.5 4.0 4.5 5.0 5.5 Input voltage VIN (V) 6.0 6.5 TA = 25 C 175 170 165 160 155 150 145 -20 0 20 40 60 80 100 Ambient temperature TA (C) VDET - TA characteristic Overcurrent detection voltage VDET (mV) VDETT - TA characteristic 1.12 Timer latch detection voltage VDETT (V) 340 VIN = 5 V 330 320 310 300 290 280 270 -20 VIN = 5 V 1.1 1.08 1.06 1.04 1.02 1.0 0.98 -20 0 20 40 60 80 100 Ambient temperature TA (C) 0 20 40 60 80 100 Ambient temperature TA (C) 5 PD16901 ISCP - TA characteristic 5 140 ICC (OFF) - TA characteristic VIN = 5 V Timer latch pin output current ISCP ( A) VIN = 5 V Standby current ICC (OFF) ( A) 0 40 60 20 80 100 Ambient temperature TA (C) 4 120 100 80 60 40 20 3 2 1 0 -20 0 -20 0 20 40 60 80 100 Ambient temperature TA (C) 6 PD16901 STANDARD CONNECTION DIAGRAM 4.5 V to 5.5 V ON/OFF CIN + 33 F CT 0.1 F 0.1 F C1 C2 0.1 F VIN CDLY C1H C1L C2 L 33 H Reference voltage circuit Startup circuit Timer latch short-circuit protection circuit Charge pump circuit D VSW F/F SW + 15 F COUT Oscillation circuit Overcurrent detection circuit C.S. RCS FB 68 k RT GND 0.3 Remark The circuit constants and circuit configuration in this connection diagram are shown for illustrative purposes and not intended for volume production design. ELECTRICAL SPECIFICATIONS (as per standard connection diagram. TA = 25 C, VIN = 5 V, IOUT = 140 mA unless specified otherwise) Item Output voltage Symbol VOUT Condition 4.5 V VIN 5.5 V 0 mA IO 140 mA 0 C TA 60 C 4.5 V VIN < 5.5 V 0 mA IO < 140 mA MIN. 11.52 TYP. 12.00 MAX. 12.48 Unit V Input stability Load stability Conversion efficiency Operating circuit current Standby circuit current Startup voltage REGIN REGL 0.5 0.004 83 %/V %/mA % 3.0 100 mA ICC ICC(OFF) VIN(start-up) IO = 0 ON/OFF pin voltage = 0 A V 3.7 4.3 Remark These specifications are reference values confirmed with the standard connection diagram (without taking account of variations) and are not intended to guarantee the characteristics of the product as a DC/DC converter. 7 PD16901 STANDARD CHARACTERISTIC CURVES (as per standard connection diagram) - IO characteristic IO (MAX) - VIN characteristic 350 Maximum output current IO (MAX) (mA) 100 VIN = 5.5 V Conversion efficiency (%) 80 VIN = 4.5 V 60 VIN = 5 V 300 250 TA = 85 C TA = 25 C TA = 0 C 200 150 100 50 0 40 20 0 0 25 50 75 100 125 Output current IO (mA) 150 3.5 4.0 4.5 5.0 5.5 6.0 Input voltage VIN (V) 6.5 VO - IO characteristic 13 VIN = 5V 12.5 Output voltage VO (V) Output voltage VO (V) VO -TA characteristic IO = 140 mA VIN = 5.5 V VIN = 5 V 12 VIN = 4.5 V 11.5 12.5 12 11.5 11 0 25 50 75 100 125 Output current IO (mA) 150 11 -20 0 20 40 60 80 100 Ambient temperature TA (C) 8 PD16901 RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the conditions recommended below. For soldering methods and conditions other than those recommended, please contact your NEC sales representative. For details of recommended soldering conditions, refer to the information document "Semiconductor Device Mounting Technology Manual." Recommended Condition Symbol IR35-00-3 Soldering Method Infrared reflow Soldering Conditions Package peak temperature: 235 C; Duration: 30 sec. max. (210 C or above): Number of times: Max. 3; Time limit: NoneNote Flux: Rosin type flux with reduced chlorine content (chlorine 0.2 Wt% or less) is recommended. Package peak temperature: 215 C; Duration: 40 sec. max. (200 C or above): Number of times: 1; Time limit: NoneNote Flux: Rosin type flux with reduced chlorine content (chlorine 0.2 Wt% or less) is recommended. Package peak temperature: 260 C or less, Duration: 10 sec. max., Preparatory heating temperature: 120 C or less; Number of times: 1 Flux: Rosin type flux with reduced chlorine content (chlorine 0.2 Wt% or less) is recommended. VPS VP15-00-1 Wave soldering WS60-00-1 Note For the storage period after unpacking from the dry-pack, storage conditions are max. 25 C, 65% RH. Caution Use of more than one soldering method should be avoided. REFERENCE DOCUMENTS NEC Semiconductor Device Reliability/Quality Control System Semiconductor Device Quality Guarantee Guide Semiconductor Device Mounting Technology Manual 10983E MEI-1202 C10535E 9 PD16901 [MEMO] 10 PD16901 [MEMO] 11 PD16901 No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. Anti-radioactive design is not implemented in this product. M4 96.5 |
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